NASA Assessment of Damage and Remaining Life in Leadfree Electronics Under Thermal Stress

A NASA Ames method for prognostication of accrued damage in leadfree electronics subjected to sequential thermal aging and thermal cycling. The approach uses the LM Algorithm with microstructural damage indicators, specifically phase-growth and IMC thickness, validated on assemblies aged at 125°C and cycled from -55 to 125°C. Damage equivalency relationships between storage aging and field deployment reliability were derived and validated.

Use Cases

• Predicting remaining useful life of electronic assemblies based on damage proxies like phase-growth.
• Estimating accrued prior damage from overlapping thermal stresses using the LM Algorithm.
• Validating damage equivalency relationships between thermal aging and thermal cycling environments.
• Comparing prognostics algorithm performance using different leading indicators like IMC thickness.

Strengths

• Method validated on leadfree assemblies subjected to specific thermal conditions (125°C aging, -55–125°C cycling).
• Approach demonstrated using two separate damage proxies (phase-growth and IMC thickness) with convergent results.
• Prognostics metrics were used to quantitatively evaluate algorithm performance.

Limitations

• Column-level documentation is absent; field semantics must be inferred after download.
• Row count is unknown, which may limit suitability assessment.
• Data is presented in a PDF format, which may require extraction for computational analysis.

Provenance

Source

National Aeronautics and Space Administration (NASA)

Collection Method

A developed prognostication method using the LM Algorithm and microstructural damage indicators on test assemblies.

Time Range

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Freshness

Last updated 2026-03-13 20:29:52.062413; freshness should be verified.

Geography

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