Thermal Treatment Effects on Defatted Soybean Flour Adhesive Properties

Experimental data investigates the effects of thermal treatment at five temperatures (65, 80, 95, 110, and 125 °C) on defatted soybean flour for wood adhesive applications. The study measures chemical structure, crystalline degree, water-insoluble content, acetaldehyde value, thermal stability, and bonding properties of adhesives. It was authored by Bing-Han Zhang and published in 2020.

Use Cases

• Analyze the relationship between thermal treatment temperature and the resulting water-insoluble content and acetaldehyde value of T-DSF.
• Model the bonding properties of T-DSF-based adhesives with crosslinker EMPA based on measured chemical and thermal stability metrics.
• Investigate the correlation between protein-protein self-crosslinking or Maillard reactions and the improved water resistance demonstrated in plywood tests.

Strengths

• Data is derived from a controlled experiment testing five specific thermal treatment temperatures (65, 80, 95, 110, and 125 °C).
• Includes quantitative results such as the highest measured water-insoluble content (27.28%) and acetaldehyde value (26.81 mmol/g).
• Adhesive performance is validated with a 28-hour boiling-dry-boiling accelerated aging test on plywood.

Limitations

• The dataset size, number of rows, and specific column structure are not provided in the input.
• Data is from a single, controlled laboratory study, which may limit generalizability to industrial-scale processes.
• The temporal coverage is limited to the experimental period, with no indication of longitudinal or repeated measurements.

Provenance

Source

Dryad digital repository.

Collection Method

Laboratory experiment measuring chemical, thermal, and mechanical properties of thermally-treated defatted soybean flour and its adhesives.

Time Range

Experimental period leading to publication in 2020.

Freshness

Last updated in June 2020.