CMOS IC Accelerated Aging Data for Implantable Neurotechnology

4.3 years of accelerated life testing data on plasma-enhanced silicone encapsulated CMOS ICs for implantable medical devices. The study, conducted by Ahmad Shah Idil, presents long-term validation results from test structures immersed in saline under DC and biphasic biases at elevated temperatures. The findings demonstrate the robustness of the encapsulation method for bioelectronic implants.

Use Cases

• Analyze electrochemical impedance spectroscopy (EIS) data to model insulation failure rates over time.
• Correlate visual corrosion observations on wire bonds and solder pads with electrical degradation metrics.
• Validate the performance of the perforated shield layer and double-layer wall-of-vias design under different temperature and bias conditions.
• Compare failure modes and device longevity across three accelerated aging temperatures (47°C, 67°C, 87°C).

Strengths

• Longest known accelerated aging study of its kind, spanning 4.3 years.
• Test structures were subjected to three distinct temperature conditions (47°C, 67°C, 87°C) and two bias types (DC, biphasic).
• Results include both electrochemical impedance spectroscopy (EIS) data and visual corrosion observations.

Limitations

• The primary data is contained within a 9.1 MB PDF report; underlying raw datasets (e.g., time-series EIS measurements) are not provided as separate, machine-readable files.
• Sample size (number of test structures) is not specified in the provided description.
• The dataset's scale is limited to the specific encapsulation method and IC design tested.

Provenance

Source

Ahmad Shah Idil via figshare.

Collection Method

Accelerated life testing of encapsulated CMOS IC test structures immersed in saline solution under controlled temperature and electrical bias.

Time Range

Testing conducted for up to 4.3 years.

Freshness

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Geography

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