Evaluation of the post cure use on the thermal and mechanical properties of a room tempera

A room temperature curing epoxy system was submitted to post cure cycles at 75°C, 90°C, and 110°C for one hour and at 110°C for two hours. The study by Gabriel Benedet Dutra measured properties including glass transition temperature, thermal degradation, and elastic modulus values between 1.72 GPa and 2.18 GPa. The results indicate the amount of resin and curing agent had a more significant influence on full curing than the post cure cycles.

Use Cases

• Modeling polymer cure kinetics based on temperature-time transformation (TTT) diagram analysis mentioned in the description
• Predicting thermal degradation behavior based on thermogravimetric (TGA) results showing a 70% mass loss between 330.9°C and 345.1°C
• Analyzing the influence of resin and curing agent ratios on material hardness and elastic modulus
• Comparing the effects of different post-cure temperature cycles (75°C, 90°C, 110°C) on final material properties

Strengths

• Specific post-cure temperature cycles (75°C, 90°C, 110°C) and durations (1 hour, 2 hours) are documented
• Quantitative results include elastic modulus values between 1.72 GPa and 2.18 GPa and thermal degradation temperature ranges (330.9°C to 345.1°C)
• Analysis includes multiple characterization techniques: differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and mechanical testing

Limitations

• Row count is unknown, which may limit suitability assessment
• Column-level documentation is absent; field semantics must be inferred after download
• Last update date is unknown; freshness unverified

Provenance

Source

Gabriel Benedet Dutra via paperswithcode

Collection Method

Experimental study involving casting epoxy samples and performing post-cure cycles with subsequent thermal and mechanical characterization.