Images of a polished wedge on ground HPFS7980 (etched) for the visualization of subsurface

Digital microscopy and co-registered optical coherence tomography images of a ground fused silica sample (HPFS7980). The dataset, by Samson Frank, is a TIFF-Stack with three layers: DM, DM+AIP, and DM+CCDM, where the colormap in Layer 3 ranges from -5 µm to 70 µm.

Use Cases

• Train computer vision models for subsurface damage detection based on the co-registered OCT and microscopy images.
• Develop image segmentation algorithms based on the layered TIFF-stack structure (DM, DM+AIP, DM+CCDM).
• Calibrate depth measurement models based on the colormap ranging from -5 µm to 70 µm in Layer 3.
• Analyze the effects of wet etching and spherical polishing on material surfaces based on the described sample preparation.

Strengths

• Dataset includes co-registered OCT and digital microscopy images, providing multimodal data for analysis.
• Layer 3 includes a specific colormap range from -5 µm to 70 µm, offering quantitative depth information.

Limitations

• Row count and dataset size are unknown, which may limit suitability assessment.
• Column-level documentation is absent; field semantics must be inferred after download.
• Last update date is unknown; freshness unverified.

Provenance

Source

Samson Frank via paperswithcode

Collection Method

Images captured via digital microscopy and optical coherence tomography on a processed fused silica sample.