Numerical Simulation Data for Pulsed-Laser Thermoelastic Reliability in Nanoscale Copper

A dataset and source code for a computational model of pulsed-laser heating in nanoscale copper current collectors and interconnects. The dataset, authored by Mohamed Abdelsabour Fahmy and last updated on 2026-05-31, includes results from a fractional nonlocal thermoelastic framework solved using the boundary element method. It is a 4.2 MB ZIP file licensed under CC-BY-4.0.

Use Cases

• Predicting temperature fields in nanoscale copper structures based on the described fractional heat conduction model.
• Analyzing nonlocal stress and von Mises stress redistribution under ultrafast pulsed heat flux as mentioned in the description.
• Assessing interfacial peeling traction and mixed-mode delamination risk for microelectronic interconnects.
• Validating numerical methods for coupled thermoelastic problems using the provided boundary element formulation.

Strengths

• Includes full source code for the computational model, enabling reproducibility and modification.
• Dataset is 4.2 MB, making it a manageable download for inspection and use.
• The description details a sophisticated model incorporating thermal memory, nonlocal elasticity, and temperature-dependent conductivity.

Limitations

• Row count and column-level documentation are unknown, which may limit suitability assessment.
• The dataset's small size (4.2 MB) suggests it may contain limited numerical results rather than extensive simulation runs.

Provenance

Source

figshare, authored by Mohamed Abdelsabour Fahmy.

Collection Method

Generated via a computational boundary element method model.

Time Range

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Freshness

Last updated 2026-05-31 21:25:53; freshness should be verified.

Geography

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