LPA Fit Statistics (BIC Values) for Technostress Study in Automated Manufacturing

605 employees across five automated manufacturing plants participated in a two-wave panel study on technostress and worker well-being. The dataset contains BIC values from Latent Profile Analysis used to model the relationships between technostress, job resources, psychosocial safety climate, and outcomes like mental health and safety. Researcher Umet Elbir published the data on figshare in April 2026 under a CC-BY-4.0 license.

Use Cases

• Modeling the relationship between technostress and worker outcomes based on the study's multilevel framework.
• Analyzing the moderating effect of job resources like supervisory ICT support and digital literacy on stress.
• Investigating the role of Psychosocial Safety Climate (PSC) as a higher-order organizational resource.
• Benchmarking statistical model fit using BIC values for similar occupational health studies.

Strengths

• Data originates from a structured two-wave panel study with 605 baseline and 450 follow-up participants.
• Study design spans five distinct automated manufacturing plants, providing a multi-site perspective.
• The dataset is small (5.5 KB) and in XLS format, facilitating quick inspection and analysis.

Limitations

• Column-level documentation is absent; field semantics must be inferred after download.
• Row count is unknown, which may limit suitability assessment for certain modeling tasks.
• The dataset contains only BIC values, not the raw survey data used in the original study.

Provenance

Source

figshare

Collection Method

Data collected via a two-wave panel survey from employees in automated manufacturing plants.

Time Range

The study involved a four-week follow-up period; specific collection dates are not provided.

Freshness

Last updated 2026-04-03 17:39:43; freshness should be verified.

Geography

Data collected from five automated manufacturing plants; specific locations are not provided.