Bandgap Reference Simulation Data with Two-Stage Curvature Compensation in 65-nm CMOS

Post-layout simulation data supporting the design of a sub-1 ppm/°C bandgap reference circuit. The dataset, uploaded by Luqiang Che in April 2026, is structured into 9 Excel sheets containing temperature characteristics, corner analysis, and Monte Carlo results. It is licensed under CC BY 4.0 for reuse with attribution.

Use Cases

• Analyzing temperature coefficient performance based on the temperature-dependent voltage data across process corners.
• Comparing single-stage and two-stage curvature compensation schemes based on the provided performance comparison sheets.
• Evaluating power supply rejection ratio (PSRR) based on the frequency sweep simulation data.
• Assessing manufacturing yield and mismatch variation based on the Monte Carlo simulation results.

Strengths

• Data is organized into 9 specific sheets covering theoretical terms, temperature characteristics, corner analysis, and statistical simulations.
• Includes simulation results across five process corners (e.g., TT) and Monte Carlo runs for statistical validation.
• File size is 967.6 KB, making it a compact and focused dataset for its domain.

Limitations

• Column-level documentation is absent; field semantics must be inferred after download.
• Row count is unknown, which may limit suitability assessment for large-scale statistical analysis.
• Data is simulation-based; real-world silicon performance may vary.

Provenance

Source

Luqiang Che via figshare

Collection Method

Post-layout circuit simulation

Time Range

Simulation data associated with a specific design project; exact date range not specified.

Freshness

Last updated 2026-04-21 14:52:32; freshness should be verified.

Geography

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