Replication Package: Contract-Aware Data Product Models from a Semiconductor Firm

1.7 MB of research replication materials from a Design Science Research project at a semiconductors firm. The package includes interview transcripts, coded projects, and USE tool artifacts, authored by Indika Kumara and last updated on 2026-04-25. Files are provided in PDF, SOIL, ATLASTI, USE, and DRAWIO formats under a CC-BY-4.0 license.

Use Cases

• Analyzing qualitative research methodologies based on the provided interview transcripts and coded projects.
• Studying the application of the USE tool for modelling contract-aware data products.
• Replicating or extending the Design Science Research findings on data product design in the semiconductor industry.

Strengths

• Includes multiple artifact types (interviews, coded projects, tool outputs) for methodological triangulation.
• Released under a permissive CC-BY-4.0 license, facilitating reuse and sharing.
• Files are relatively small (1.7 MB), ensuring quick download and inspection.

Limitations

• Row count and column-level documentation are unknown, limiting suitability assessment.
• The description metadata is limited; actual data quality and structure require manual inspection after download.

Provenance

Source

figshare

Collection Method

Likely gathered through Design Science Research involving interviews and tool-based modelling at a semiconductors firm.

Freshness

Last updated 2026-04-25 09:50:56; freshness should be verified.